Industry Insights Articles

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Compound Semiconductor

ROHM and BASiC Semiconductor form a strategic partnership

Sensing and Actuating

Omnitron Sensors solves reliability, size, cost issues with LiDARs

Compound Semiconductor

Indium phosphide industry moving into consumer applications

Compound Semiconductor

STMicroelectronics and Soitec cooperateon SiC substrate manufacturing technology

Battery

Will China succeed in its semiconductor strategy and, if so, when?

Battery

 LG chem to establish largest cathode plant in US for EV batteries

Battery

SK On, Ecopro, and GEM build a nickel supply chain in Indonesia

Radio Frequency

GM rolls out expanded super cruise network

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Sensing and Actuating

Scantinel Photonics lands €10 million for next gen LiDAR solutions for autonomous vehicles and industry

Power Electronics

Renault is accelerating the decarbonisation plan for its plants in France and innovating with new partners: Voltalia, ENGIE, and Dalkia

Computing and Software

Valeo has produced its 10 millionth front camera system integrating Mobileye EyeQ® technology

Compound Semiconductor

The automotive industry is a big growth segment for passive components – An interview with KEMET

Computing and Software

New Japanese chipmaker Rapidus joins development and investment race

Sensing and Actuating

First 3-axis quantum inertial sensor: an important step towards drift-free navigation systems

Compound Semiconductor

Kyocera develops world’s first* automotive night vision system with white and near-infrared light diodes integrated into a single GaN laser device

Computing and Software

ADAS and autonomous vehicle, two different faces of the same trend

Sensing and Actuating

Baraja surpasses 100 patent filings to advance IP portfolio globally

Memory

Everspin explores domestic trusted manufacturing expansion

Sensing and Actuating

Hesai Lidar announces ADAS design win for changan’s new series production vehicles

Semiconductor Manufacturing

ERS electronic offers improved warpage correction performance for fan-out wafer-level packaging with its next-generation WAT330