Industry Insights
Global Semiconductor Trends
$2.4 trillion by 2031: welcome to the new semiconductor math
Computing and Software
Navitas and Magnachip Announce Strategic Partnership to Accelerate High-Voltage and Ultra-High-Voltage Silicon Carbide Adoption
Compound Semiconductor
Bosch announces $225 million direct funding agreement with the U.S. Department of Commerce as part of a $2 billion investment in Roseville, Calif.
Memory
What a year for memory!
Semiconductor Packaging
Inspection and metrology catching up for high-density fan-out panel packaging
Sensing and Actuating
Silex establishes U.S. manufacturing capacity – acquires semiconductor fab in Pennsylvania
Sensing and Actuating
Silex establishes U.S. manufacturing capacity – acquires semiconductor fab in Pennsylvania
Sensing and Actuating
From IPO to expansion: Silex’s next growth chapter
Infineon RASIC™ CTRX8188F enters mass production as automotive industry’s first 8Tx8Rx imaging radar MMIC, accelerating the shift to centralized radar architectures
Semiconductor Equipment
China’s semiconductor equipment industry: who’s leading, who’s lagging?
Photonics and Lighting
Grant notification presented: X-FAB develops Erfurt site into a center for microsystems technology
Semiconductor Equipment
Accepting Orders for the LED Light Source–Equipped New Products “UX-44101SCB / UX-45114SCB” of the UX-4 Series, Full Field Projection Aligner for Wafers
Battery
ProLogium and Elysian Aircraft BV Sign MoU：Exploring Next generation Battery Applications in Aerospace to Advance the Vision of Zero-Emission Aviation and Future Mobility
Compound Semiconductor
Infineon Found to Infringe Innoscience Patents, Barred from Selling in China
Semiconductor Equipment
ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration
Semiconductor Materials
SCHMID Group announces Agreement for New China Manufacturing Campus to Support Future Growth
Semiconductor Equipment
AI’s hidden enabler: metrology & inspection
Semiconductor Equipment
Teradyne and TEL Collaborate on Advanced Packaging Test Solution for AI Devices
Sensing and Actuating
From Beijing to Yokohama: key signals shaping the future of mobility
Global Semiconductor Trends