Industry Insights Articles

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Battery

Electrification: is it now? Not really…

Memory

NEO semiconductor releases technology CAD (TCAD) simulation data for ground-breaking 3D X-DRAM

Semiconductor Packaging

Advanced packaging chessboard: Apple, TSMC, Amkor play the game

Computing and Software

STMicroelectronics accelerates Edge AI adoption to help companies transform their products

Computing and Software

CES world premiere: Bosch unites infotainment and driver assistance functions on one chip

Compound Semiconductor

What’s next for the SiC and GaN markets?

Semiconductor Manufacturing

Applied Materials and CEA-Leti unveil joint lab for rapidly growing specialty chip markets

Semiconductor Manufacturing

Mycronic receives order for an SLX mask writer

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Display

MicroLEDs: horizontal ecosystems are setting up to compete

Radio Frequency

Macom completes acquisition of Wolfspeed’s RF business

Display

BOE Technology and Universal Display enter into long-term OLED agreements

Battery

First Phosphate and Sun Chemical sign MOU for the development of a lithium iron phosphate cathode active materials manufacturing business in North America

Power Electronics

SAIC Motor and JSW announce a strategic joint venture to accelerate growth with focus on green mobility

Power Electronics

Mitsubishi Electric announces name of new subsidiary succeeding to automotive-equipment business as part of restructuring

Computing and Software

AWS unveils next generation AWS-designed chips

Semiconductor Manufacturing

Mycronic receives order for an SLX mask writer

Battery

CALB strategically drives nationwide electrification transformation of reservoir ship

Battery

BYD rolled off its 6 millionth new energy vehicle

Semiconductor Manufacturing

Amkor announces US advanced packaging and test facility