Industry Insights

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Computing and Software

VoxelSensors expands its spatial and empathic computing solutions with gaze tracking, acquires EyeWay Vision’s IP, and unveils the plan for its first spatial awareness system for mobile

Compound Semiconductor

Yole Group Viewpoint – Semiconductor strength in mobile phones

Compound Semiconductor

From Mate 30 Pro 5G to Mate 60 Pro: a technology path from China

Computing and Software

WHAT’S IN THE BOX? DMS and OMS from Desay SV, LCE and Sunny Smartlead at a glance

Imaging

Spectricity announces collaboration with Qualcomm to bring spectral imaging to next generation smartphones, unlocking accurate color and seeing beyond what’s visible

Imaging

Metalenz confirms Samsung ISOCELL vizion image sensor as light- engine for polar ID, the world’s smallest, most affordable and secure face unlock solution

Battery

Volvo Cars to propose a distribution of 62.7 percent of its Polestar shareholding to its shareholders

Imaging

Tesla’s module Teardowns from our Automotive Track

Prophesee’s metavision® image deblur solution for smartphones is now production-ready, seamlessly optimized for the snapdragon 8 Gen 3 mobile platform

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Computing and Software

Andes Technology and MetaSilicon collaborate to build the world’s first automotive-grade CMOS image sensor product using RISC-V IP SoC

Imaging

TrinamiX, Visionox and STMicroelectronics present cost-efficient, secure face authentication system for behind-OLED integration in smartphones

Computing and Software

JASM set to expand in Kumamoto Japan

Battery

Sony, Honda EV venture to roll out three models before 2030 – Nikkei

Computing and Software

WHAT’S IN THE BOX? All-in-one front cameras from Continental and HL Klemove at a glance

Computing and Software

Yole Group Viewpoint – Pushing silicon boundaries: advanced semiconductor packaging for high-end performance

Imaging

Teledyne to acquire Adimec

Imaging

Motorola Solutions acquires silent sentinel, a provider of specialized, long-range cameras

Imaging

Immervision awarded a design and development contract with VIA optronics AG for VIA´s next generation automotive camera

Imaging

Headwall acquires inno-spec GmbH

Imaging

Leonardo DRS selects QI to provide the MIRA camera for its JETS II offering