Industry Insights
Computing and Software
Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
Computing and Software
Intel announces $5.7 billion AI-driven capital investment in Ireland
Semiconductor Packaging
Inspection and metrology catching up for high-density fan-out panel packaging
Semiconductor Equipment
China’s semiconductor equipment industry: who’s leading, who’s lagging?
Semiconductor Materials
SCHMID Group announces Agreement for New China Manufacturing Campus to Support Future Growth
Semiconductor Equipment
AI’s hidden enabler: metrology & inspection
Semiconductor Packaging
IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
Compound Semiconductor
Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing
Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX
Semiconductor Materials
SCHMID Group N.V. announces closing of the second tranche of its USD 30 million convertible notes financing
Semiconductor Materials
SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026
Semiconductor Packaging
Breaking the wafer barrier: how advanced packaging is scaling in the AI era
Power Electronics
Power module packaging evolves as materials and supply chains redefine power electronics
Semiconductor Equipment
Exclusive-Besi fields takeover interest on surging demand for advanced chip packaging, sources say
Global Semiconductor Trends
BESI at the center of the packaging power shift
Photonics and Lighting
Photonics packaging heads toward a $14.4 billion market by 2031
Semiconductor Packaging
New ultra-large optical MEMS lids enable next-generation optical circuit switching (OCS) and sensing
Semiconductor Equipment
AI supply chain at risk: between T-glass shortage and emerging glass core
Power Electronics
Power electronics at a strategic turning point – NEPCON 2026 post show report
Semiconductor Packaging