Industry Insights Articles

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Compound Semiconductor

Silicon photonics: from transceivers to speed-of-light AI

Computing and Software

Renesas introduces 32-bit RX MCU with high-speed, high-precision analog front end for high-end industrial sensor systems

Sensing and Actuating

Point one navigation releases the atlas real-time inertial navigation system

Computing and Software

Polestar 4 to integrate Luminar LiDAR with Mobileye Chauffeur

Sensing and Actuating

Oxford Nanopore Technologies acquires Northern Nanopore Instruments, expanding innovation pipeline in solid-state nanopore-based sensing

Sensing and Actuating

TERA strengthens its position in the real-time air quality monitoring sector with the acquisition of OMWAVE

Compound Semiconductor

The photonics world is changing…

Imaging

Microfluidics innovation: Next-Generation Sequencing reshaping healthcare

SiTime acquires clock products from Aura Semiconductor

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Sensing and Actuating

Butterfly Network announces 5-year co-development agreement with forest neurotech for next-generation brain computer interfaces using ultrasound-on-chip™ technology

Sensing and Actuating

TDK and LEM set to collaborate on next-generation TMR-based integrated current sensors for electrification applications

Sensing and Actuating

Allegro wins BMW current sensor business

Computing and Software

Prophesee emboldens its mass consumer outreach

Computing and Software

2023 Imaging Outlook

Imaging

Through the lens of AutoSens 2023

Photonics and Lighting

Racing ahead in vehicle electrification allows Chinese OEMs to define the roadmap for LiDAR  

Sensing and Actuating

Thermo Fisher Scientific to acquire Olink, a leader in next-generation proteomics

Battery

2023 Automotive Outlook

Photonics and Lighting

Bionano prices $80.0 million financing in convertible notes and warrants, announces preliminary Q3 2023 results, and implements streamlined operational plan

Computing and Software

JetCool raises $17 million series A funding round to meet escalating demand for data center cooling driven by the AI and high-density semiconductor boom