Industry Insights
Power Electronics
How copper sintering could transform power electronics packaging – An interview with CuNex, part of Schlenk
Compound Semiconductor
Building the next generation of power systems with GaN – An interview with Infineon Technologies
Sensing and Actuating
Safran navigates the future: high-end inertial sensing in a shifting world – An interview with Safran
Sensing and Actuating
From silence to sound: MEMS brings a breath of fresh air – An interview with xMEMS
Compound Semiconductor
Shaping the future of power electronics with GaN– An interview with VisIC Technologies
Semiconductor Packaging
Next-generation printing solutions for advanced semiconductor packaging – An interview with Scrona
Imaging
Following Sony’s journey into automotive image sensors – An interview with Sony Semiconductor Solutions
Photonics and Lighting
Driving vision: inside China’s LiDAR revolution – An interview with Hesai
Driving efficiency: Sumitomo Bakelite’s role in power module packaging evolution– An interview with Sumitomo Bakelite
Imaging
How did metasurfaces transition from sorcery to commercial reality? – An interview with NIL Technology
Semiconductor Packaging
Hybrid Bonding: latest advancements 2.5D & 3D packaging industry – An interview with ADEIA
Computing and Software
MCU integration to increase as EV architecture evolves – An interview with STMicroelectronics (part 1)
Computing and Software
MCU integration to increase as EV architecture evolves – An interview with STMicroelectronics (part 2)
Battery
Beyond Lithium-Ion batteries: innovation is on the rise – An interview with Ampcera
Memory
Innovating at the Atomic Scale – An Interview with Spin-Ion Technologies
Semiconductor Equipment
Materials for advanced IC substrates: A new entry point to the supply chain for emerging players – Interview with LQDX
Compound Semiconductor
Power SiC: the cornerstone of ROHM’s business expansion in the next five years – An interview with ROHM
Imaging
From imaging to sensing, exploring new opportunities for 3D CMOS image sensors – An interview with GlobalFoundries
Semiconductor Packaging
An emerging player makes a promising entry into Europe – An interview with Silicon Box
Photonics and Lighting