Industry Insights

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Memory

What a year for memory!

Photonics and Lighting

InP or out: the real reason behind Coherent’s $50 million bet

Semiconductor Packaging

Inspection and metrology catching up for high-density fan-out panel packaging

Sensing and Actuating

From IPO to expansion: Silex’s next growth chapter

Sensing and Actuating

MEMS-based optical switches: a strategic technology for AI data centers

Semiconductor Equipment

China’s semiconductor equipment industry: who’s leading, who’s lagging?

Photonics and Lighting

Making qubits is hard and manufacturing them even harder

Semiconductor Equipment

AI’s hidden enabler: metrology & inspection

From Beijing to Yokohama: key signals shaping the future of mobility

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Photonics and Lighting

From display technology to AI infrastructure: the new role of microLED

Radio Frequency

Automotive mmWave radar: global competitive landscape and the China factor

Memory

Memory’s valuation reset: the trillion-dollar club now has three DRAM giants

Power Electronics

From 48V to 800V: the new AI power shift

Display

XR, OLED, and microLED are racing ahead – Display Week 2026 post show report

Sensing and Actuating

Beijing 2026 confirms: ADAS has entered the compute era

Computing and Software

NVIDIA Thor under Yole Group’s microscope

Photonics and Lighting

Opinion: optical transceivers at the chokepoint of AI growth and supply chain constraints

Photonics and Lighting

Is the spectrum war over? How RF and optical buried the hatchet to build the SatCom of tomorrow

Memory

The memory cycle, rewritten

Semiconductor Packaging

Breaking the wafer barrier: how advanced packaging is scaling in the AI era