Industry Insights
Global Semiconductor Trends
Semiconductors in the AI era: more value, not more silicon
Sensing and Actuating
Sensing, imaging, and RF: the three pillar technologies serving “physical AI”
Semiconductor Packaging
Advanced packaging comes home
Global Semiconductor Trends
RETHINKING THE SEMICONDUCTOR SUPPLY CHAIN – OPINION SERIES
Memory
Amidst the ongoing AI boom, China’s memory ambitions lurk around the corner
Global Semiconductor Trends
$2.4 trillion by 2031: welcome to the new semiconductor math
Radio Frequency
Apple and Broadcom extend commitment to 2031: the deal behind the deal
Photonics and Lighting
Quantum computing moves from physics problem to manufacturing problem
Photonics and Lighting
InP or out: the real reason behind Coherent’s $50 million bet
Semiconductor Packaging
Inspection and metrology catching up for high-density fan-out panel packaging
Sensing and Actuating
From IPO to expansion: Silex’s next growth chapter
Sensing and Actuating
MEMS-based optical switches: a strategic technology for AI data centers
Semiconductor Equipment
China’s semiconductor equipment industry: who’s leading, who’s lagging?
Photonics and Lighting
Making qubits is hard and manufacturing them even harder
Semiconductor Equipment
AI’s hidden enabler: metrology & inspection
Sensing and Actuating
From Beijing to Yokohama: key signals shaping the future of mobility
Photonics and Lighting
From display technology to AI infrastructure: the new role of microLED
Radio Frequency
Automotive mmWave radar: global competitive landscape and the China factor
Memory