Industry Insights Articles
CES 2023 display review
Photonics and Lighting
Volkswagen ID3 matrix LED-based headlamp stripped bare by PISÉO
Compound Semiconductor
Denso boost converter for the FCEV Toyota Mirai II: the SiC technology screened by Yole SystemPlus
Radio Frequency
Ericsson 5G Integrated Radio Unit Chipset
Apple iPhone 14 series
Photonics and Lighting
First and second generation Valeo Scala LiDARs: the technology gap revealed
Computing and Software
Apple invites us to dream…
Imaging
The second-generation Face ID is (again) a Marvel of technology
Google ignores the rulebook and adopts an alternate 5G mmWave solution for smartphones
Computing and Software
Semiconductor in smartphones: what are the design wins? – Smartphone Design Win Monitor, Q2 2021
Computing and Software
What are the supply chain differences between a US designed $100 BoM phone from BLU and the latest iPhone ? – Smartphone Design Win Monitor: BLU and Apple comparison
Computing and Software
Apple wants to control its whole manufacturing & supply chain
Computing and Software
Smartphone Design Win Monitor: discover the decisions that global manufacturers make
Under the Hood: the innovation-rich Golf 8
Imaging
Apple’s novel Sensor-shift OIS in the iPhone 12 Pro Max camera
Compound Semiconductor
A reflection on 2020 and a look at the year ahead
Computing and Software
Probing the Apple M1’s hidden depths
Computing and Software
Under the hood: Microbolometer-based thermal AI camera
Cirrus Logic enters Apple’s Smart Watch world
Sensing and Actuating