Industry Insights
Global Semiconductor Trends
Xiaomi’s electrifying gamble
Computing and Software
XPENG and the Volkswagen announce entry into the framework agreement on E/E architecture technical collaboration
Display
Vuereal strengthens global partner ecosystem with toray engineering alliance, accelerating global adoption of microsolid printing
Semiconductor Equipment
Intel industry’s first mover on High NA EUV lithography system
Battery
SA’s first off-grid electric charging network underway
Computing and Software
What works best for chiplets
Memory
Micron set to get $6.1 bln in chip grants from US
Memory
Micron first to production of 200+ layer QLC NAND in client and data center
JBD unveils ARTCs: Revolutionary equipment redefines image quality standards for waveguide-based AR glasses
Computing and Software
Intel builds world’s largest neuromorphic system to enable more sustainable AI
Computing and Software
Untether AI announces collaboration with Arm to deliver high performance, energy-efficient solutions
Memory
ZeroPoint Technologies signs global customer to bring hardware-accelerated compression to hyperscale data centers
Computing and Software
Underappreciated EU suppliers lead the semiconductor equipment market
Compound Semiconductor
TriEye and Vertilas partner to demonstrate 1.3μm VCSEL-driven SWIR sensing solutions
Computing and Software
Microchip Technology acquires Neuronix AI Labs
Computing and Software
Advantech collaborates with Phison to develop GenAI computing platform for edge and industrial applications
Computing and Software
SiTime continues to advance precision timing with an integrated clock chip for AI datacenters
Sensing and Actuating
Fortemedia unveils groundbreaking coil-based MEMS speaker product family–ForteSound – supporting ultra HD music
Compound Semiconductor
With or without Apple, the microLED industry maintains its momentum
Memory