ECTC 2024
Yole group is glad to be part ECTC – 2024!
A nice opportunity to look through our latest market, technology, reverse engineering and reverse costing analysis with direct discussion with Yole Group analyst and sales team!
DO NOT MISS OUR LATEST PRODUCTS!
Create your account on the website and access more info about our products easily!
REPORTS
Status of the Advanced Packaging Industry 2023
2024 edition coming soon
- High-End Performance Packaging 2023 – 2024 edition coming soon
- Status of the Advanced Packaging Industry 2023 – 2024 edition coming soon
- Status of the Advanced IC Substrate Industry 2023 – 2024 edition coming soon
- 2.5D & 3D Packaging Comparison 2022 – 2024 edition coming soon
- Generative AI 2024 – Impact on Processors, Memory, Advanced Packaging, and Substrates
- System-in-Package 2023
- Fan-Out Packaging 2023
- Nvidia H100 Tensor Core GPU
- DBI Process in Jasminer X4-Q Mining ASIC
- AMD Instinct MI210 GPU with HBM2e
- Advanced Packaging in AMD Radeon RX 7900 XTX
- AMD 3D V-Cache with TSMC SoIC 3D Packaging
- Apple A17 SoC in iPhone 15 Pro
- Apple M1 Ultra SoC
MONITORS
MEET THE TEAM!
Gabriela Pereira
Technology & Market Analyst, Semiconductor Packaging
Felix Roxas,
Customer Success Manager
Jeff Perkins
EVP and GM at Yole Inc, part of Yole Group
Yik Yee Tan
Senior Technology & Market Analyst, Semiconductor Packaging
Josh Saenz
Sales representative – Eastern Region
A question? please contact us:
sales.us@yolegroup.com
+1 833 338 4999
