16th International Conference and Exhibition on Device Packaging – IMAPS DPC

Fan out packaging started out as a niche technology in 2011.  Fan-out packaging technology built strong momentum where it was expected that it will replace many laminate-based packages posing significant threat to substrate suppliers.  Over past ten years, it seems that fan-out packaging has found its rightful place in many high-density applications and in core-fan out arena which primarily remains the realm of the OSATs.   This “niche” area driven by the need for advanced L/S, heterogeneous integration, need for thinner, increased I/O count and more reliable packages (side wall protection).  Fan-out packaging landscape remains exciting with many players and technologies such as traditional eWLB, panel level processing, Deca’s M-series products, TSMC’s integrated fan-out and its variants, and FoCos (ASE).  Fan-out packages are also gaining traction for multi-die system in package devices where more than one die is reconstituted, and additional passives are included in such a package.  Fan-out platforms remains a more economical choice compare to 2.5D package construction with interposer design.  With advancement in fan-out materials and rise in panel level manufacturing investment led by ASE, Deca, PTI, and Samsung Electronics, it is certain that fan-out package platform will remain either a stepping stone in more advanced level packages or final choice for small and thinner path to heterogeneous integration.  This presentation will cover key players, applications and markets for fan-out packaging as well as providing market forecast and evolution of fan-out packaging technology for coming years.