Tradeshows & Conferences
16th International Conference and Exhibition on Device Packaging – IMAPS DPC
The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Yole Développement will participate in the following:
Future of Fan-out Packaging: Fan out packaging gains wider adoption expected to surpass $2B threshold by 2024 as lines between OSAT and foundry gets blurry
On March 4, 2020 from 9.30AM to 9.30AM
Vaibhav Trivedi, Sr. Technology Market Analyst, Yole Développement
Yole Développement will be exhibiting at Booth #58 with our experts on hand to answer questions and discuss your needs.