Tradeshows & Conferences
3D SEMI SYSTEMS SUMMIT 2026
Redefining Semiconductor Integration: Strategic Perspectives at the 3D & Systems Summit
The 3D & Systems Summit is a premier international event dedicated to the latest advancements in 3D integration and heterogeneous packaging technologies. The conference brings together global semiconductor leaders, R&D institutes, equipment suppliers, and assembly experts to explore technical innovations in Advanced Packaging, Chiplets, Wafer-to-Wafer bonding, and Hybrid Bonding. Participants will examine how complex system-in-package (SiP) solutions and high-density interconnects are enabling the next generation of AI-driven applications, high-performance computing, and sensor integration.
Yole Group is pleased to participate in the 3D & Systems Summit. We will share our latest market intelligence and technology roadmaps, focusing on the rapid evolution of the Advanced Packaging landscape and the transition toward Chiplet-based architectures.
Yole Group will be part of program with:
Vishal SAROHA, PhD
Technology & Market Analyst, Semiconductor Equipment
Friday, June 19th
11:20am: Driving System Level Energy Efficiency in AI with Advanced Packaging and Heterogeneous Integration
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AI energy efficiency is moving beyond transistor scaling and becoming a full system-level challenge. As AI workloads grow, a rising share of energy is consumed not only by compute, but also by memory access, data movement, interconnects, power delivery, and cooling. This presentation will examine how advanced packaging and heterogeneous integration are becoming critical enablers of performance-per-watt improvement in AI systems. The talk will cover chiplets, HBM and 2.5D integration, advanced IC substrates, fine-pitch interconnects, hybrid bonding, back-end equipment readiness, co-packaged optics, and thermal management innovations. The presentation will connect technology trends with market dynamics and manufacturing challenges, showing why packaging is evolving from an assembly function into a strategic architecture and energy-efficiency lever for next-generation AI infrastructure.
Vishal Saroha
Technology & Market Analyst, Semiconductor Equipment
Vishal Saroha is Technology & Market Analyst, Semiconductor Equipment at Yole Group.
Based in Dresden (Germany), he focuses on developing technology and market products and custom consulting projects in the manufacturing and global supply chain domain.
Prior to Yole Group, Vishal worked at GlobalFoundries, Dresden, first as an Integration & Yield Engineer and then as Sr. Engineer - Integration Engineering, where he was the owner of device and SRAM targeting-related activities on their 22FDX technology. Previously, he also had experience at imec (Belgium), where he worked on issues related to 3DIC packaging and device reliability.
Vishal holds a master's in nanotechnology from Katholieke Universiteit Leuven (Belgium) and a bachelor's in physics from the University of Delhi (India).