BEGIN:VCALENDAR VERSION:2.0 PRODID:-//hacksw/handcal//NONSGML v1.0//EN CALSCALE:GREGORIAN BEGIN:VEVENT LOCATION:DRESDEN\, GERMANY DESCRIPTION:Redefining Semiconductor Integration: Strategic Perspectives at the 3D &\; Systems Summit The 3D &\; Systems Summit is a premier international event dedicated to the latest advancements in 3D integration and heterogeneous packaging technologies. The conference brings together global semiconductor leaders\, R&\;D institutes\, equipment suppliers\, and assembly experts to explore technical innovations in Advanced Packaging\, Chiplets\, Wafer-to-Wafer bonding\, and Hybrid Bonding. Participants will examine how complex system-in-package (SiP) solutions and high-density interconnects are enabling the next generation of AI-driven applications\, high-performance computing\, and sensor integration. Yole Group is pleased to participate in the 3D &\; Systems Summit. We will share our latest market intelligence and technology roadmaps\, focusing on the rapid evolution of the Advanced Packaging landscape and the transition toward Chiplet-based architectures. Yole Group will be part of program with: Vishal SAROHA\, PhDTechnology &\; Market Analyst\, Semiconductor EquipmentFriday\, June 19th11:20am: Driving System Level Energy Efficiency in AI with Advanced Packaging and Heterogeneous Integration DTSTART:20260617T145344Z DTEND:20260619T145344Z SUMMARY: URL;VALUE=URI:https://www.yolegroup.com/event/trade-shows-conferences/3d-semi-systems-summit/ DTSTAMP:20260808T125344Z UID:6a7726d813eca END:VEVENT END:VCALENDAR