Chiplets Make Huge Chips Happen
The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts, and talk to vendors offering a wide variety of products and services.
The summit will cover:
- the latest architectures,
- development platforms and methods, and applications.
- all aspects of chiplet development, including partitioning, design, interconnect, power and thermal analysis, packaging, integration, and test.
- new methods such as 3D heterogeneous integration and wafer-level, 2.5D, and 3D packaging
Yole Group will be part of the speakers with:
Tom HACKENBERG,
Principal Analyst, Computing and Software
Yole Intelligence part of Yole Group
John LORENZ,
Senior Technology & Market Analyst, Computing and Software
Yole Intelligence part of Yole Group
They will present at the following:
Wednesday, January 25th,
Session: Chiplets: where we are today
09:00am – 10:00am: Chiplets Market Update
Thursday, January 26th,
Panel: Chiplets in 2028 and How We Got There
03:30pm – 04:30pm
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John Lorenz
Senior Technology & Market Analyst, Computing & Software
John Lorenz is a Senior Technology and Market Analyst, Computing & Software within the Semiconductor, Memory & Computing division at Yole Intelligence, part of Yole Group.
John is engaged in the development of market and technology monitors for the logic segment of advanced semiconductors, with an initial focus on processors. Prior to joining Yole, John held various technical and strategic roles at Micron Technology.
On the engineering side, his roles included thin film process development and manufacturing integration on DRAM, NAND, and emerging memory technologies and industrial engineering / factory physics for the R&D fab.
On the strategic side, John ran the memory industry supply & capex model for corporate strategy / market intelligence, and established the industry front-end costing model within strategic finance.
John has a Bachelor of Science degree in Mechanical Engineering from the University of Illinois Urbana-Champaign (USA), with a focus on MEMS devices.
Tom Hackenberg
Principal Analyst, Computing & Software
Tom Hackenberg is a Principal Analyst for Computing and Software in the Semiconductor, Memory and Computing Division at Yole Intelligence, part of Yole Group.
Tom is engaged in developing processor market monitors and research into related technology trends. He is currently focused on low and ultralow power solutions such as MCUs. Tom is an industry leading expert with more than a decade’s experience reporting on markets for semiconductor processors including CPUs, GPUs, MPUs, MCUs, SoC ASICs & ASSPs, FPGAs and configurable processors. Tom is also well-versed in related technology trends including IoT, heterogeneous processing, chiplets, AI and edge computing.
Prior to joining Yole, Tom was a principal analyst at OMDIA, IHS Markit and began processor market research in 2006 for IMS Research. He worked with market-leading processor suppliers developing both syndicated and custom research. Tom holds a BSECE from the University of Texas at Austin specializing in Processors and FPGAs.
