Tradeshows & Conferences
ECTC 2023 – IEEE 73rd ELECTRONIC COMPONENTS AND TECHONOLOGY CONFERENCE
the international event that brings together the best in packaging, components and microelectronic systems science, technology and education
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.
The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.
Yole Group will be part of it as exhibitor!
Once again in 2023, we will be glad to get the opportunity to meet our customers and business partners, establish new contacts in the industry and help drive your business forward.
Interested in an onsite meeting with us? Send us your request at events@yolegroup.com
MEET OUR TEAM IN PERSON DURING THE conference:
Gabriela PEREIRA
Technology & Market Analyst – Advanced Packaging
Yole Intelligence
Stefan CHITORAGA
Technology & Market Analyst – Packaging and Assembly
Yole Intelligence
Felicia McGuire
Project Manager
Consulting Services Division
Yole Intelligence
Jeff PERKINS
Executive Vice-President
& General Manager
Yole Inc. part of Yole Group
Senior Director
Business Development
Yole Inc. part of Yole Group
Felix ROXAS
Customer Success Manager
Yole Inc. part of Yole Group
