Tradeshows & Conferences
ECTC 2025
Pioneering the Future of Electronics Packaging
The Electronics Components and Technology Conference (ECTC) 2025 is set to be the premier event for professionals in the electronics packaging industry. This global conference will bring together experts, engineers, and innovators from across the world to explore the latest advancements in electronics technology, including cutting-edge packaging solutions, material innovations, and manufacturing techniques. With a full program of technical sessions, keynote presentations, and hands-on workshops, ECTC 2025 will offer insights into the future of electronics packaging.
Join Yole Group on-site as we will share our expertise and insights into the latest trends and developments in the electronics sector. With a focus on emerging technologies, market analysis, and innovation-driven strategies, we look forward to engaging with industry professionals and providing in-depth perspectives on the future of electronics packaging and beyond. Don’t miss the opportunity to meet our experts and discover how we can help drive your business forward.
Let’s meet onsite with our team
Yik Yee TAN, PhD
Senior Technology & Market Analyst,
Semiconductor Packaging
Bilal HACHEMI, PhD
Technology & Market Analyst,
Semiconductor Packaging
Chris YOUMAN
Senior Business Development Director
The ECTC technical program addresses new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies relevant to electronics packaging.
The IEEE’s Electronics Packaging Society (EPS) sponsors ECTC. EPS is the leading international forum for scientists and engineers engaged in research, design, and development of revolutionary advances in microsystems packaging and manufacturing. It encompasses all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components.
