ECTC 2026

ECTC 2026 is the premier international event focused on the latest advancements in electronic packaging, components, and microelectronic systems. The conference brings together global industry leaders, R&D scientists, materials suppliers, and equipment manufacturers to explore technical innovations in advanced packaging, 2.5D/3D heterogeneous integration, chiplets, and high-performance interconnects. Participants will examine how cutting-edge solutions in thermal management, modeling, and reliability are enabling the next generation of AI infrastructure, high-performance computing, and mobile devices. Through high-level technical sessions, panel discussions, and networking, ECTC provides an essential platform for collaboration and technical exchange across the entire microelectronics ecosystem.

Yole Group will be present at ECTC 2026. We will share our latest market intelligence, technology roadmaps, and strategic perspectives on the rapidly evolving packaging landscape, from wafer-level technologies to system-in-package (SiP) innovations. We look forward to connecting with the community, discussing emerging industry trends, and exploring the future of system-level optimization enabled by advanced semiconductor integration.