IC substrate : key element of the Packaging industry
The EIPC Winter Conference, which is to be held over two days, will have papers from Custer Consulting, EnergyVille, Ericsson, LiloTree, Trackwise, DP Patterning, Doosan, KLA, ASS Luippold, Dyconex, Suss MicroTec, Resonac, NanYa and others. We will also be having a Round table for environmental matters e.g. REACH SVHC solder mask restrictions, involving companies such as Agfa, Electra Polymers, Notion Systems, SUSS MicroTec, Taiyo and Parachem. There will also be a Table Top area where several companies will present themselves during the breaks of the conference.
Yole Group will be part of the speakers to cover this topic:
Emilie JOLIVET,
Semiconductor, Memory and Computing Division Director
yole Intelligence part of Yole Group
Thursday, February 9
Session 1: Business Outlook and Energy Security
09:15am – 09:35am: IC substrate : key element of the Packaging industry
ABSTRACT:
Moore and More-than-Moore applications require various types of substrates to sustain their packaging technology needs. The high demand of electronics devices from personal devices to datacenters has led to an unprecedented shortage of advanced substrate during the pandemic period reshuffling the cards of the substrates industry. This presentation will share the status of the IC substrate business and technology innovation but also the status of the several investment projects in Capex.
Global Advanced Substrate market value is expected to grow at a rate of 11% CAGR from $15.8B in 2021 to $29.6B in 2027, mainly driven by the high demand in mobile & consumer, automotive & mobility, and telecom & infrastructure.
The IC substrate is mainly driven by AP, baseband for FC CSP and 5G, HPC, GPU, server, and automotive industry for FC BGA. The market value is expected to grow at a rate of 12% CAGR from 12.6B in 2021 to $24.3B in 2027.
Main substrate technology trends are to increase the complexity towards larger areas, more layers and finer pitches and L/S by adopting processes like SAP, mSAP or amSAP. SLP technology developments remained steady in the last years while embedded die technology is aiming to enable multiple die embedding to reach more applications.
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Emilie Jolivet
Business Line Director, More Moore activities
Emilie Jolivet is Business Line Director of the More Moore activities at Yole Group.
Based on her valuable experience in the semiconductor industry, Emilie manages the expansion of the technical and market expertise of the memory, computing & software team.
In addition, Emilie’s mission focusses on the management of business relationships with semiconductor leaders and the development of market research and strategy consulting activities inside Yole Group.
Prior to Yole Group, after an internship in failure analysis at Freescale (France), she was an R&D engineer for seven years in the photovoltaic business where she co-authored several scientific articles. Then, Emilie worked at EV Group (Austria) as a business development manager in 3D & Advanced Packaging.
Emilie Jolivet holds a Master’s degree in Applied Physics specializing in Microelectronics from INSA (Toulouse, France). She also graduated with an MBA from IAE Lyon.
