Tradeshows & Conferences
EMPC 2025
the 25th european microelectronics & packaging conference
EMPC 2025 is a leading event in Europe dedicated to microelectronics packaging, assembly, and interconnection technologies. Bringing together industry leaders, researchers, and innovators, EMPC offers a platform for exchanging knowledge, exploring the latest advancements, and fostering collaboration across the entire microelectronics ecosystem. The 2025 edition will feature a comprehensive technical program, engaging keynote presentations, and an exhibition showcasing cutting-edge technologies and solutions.
Join Yole Group as we will be on-site to share insights, discuss industry trends, and connect with key players in the field. We look forward to engaging with the community, exchanging ideas, and supporting the collective progress of microelectronics packaging technologies. We warmly invite you to meet us during the event.
Yole Group will be part of program with:
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Thursday, September 18th
“Advanced Packaging” – A must for the Next-Gen AI and HPC Hardware! And not Only!
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Bilal Hachemi, PhD is a Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
He contributes on a day-to-day basis to the analysis of packaging technologies, their related materials and manufacturing processes.
Previously, Bilal carried out experimental research in the field of nanoelectronics and nanotechnologies, focusing on emerging dielectric materials and their ferroelectric applications. He (co-) authored several papers in high-impact scientific journals and was participated in several international conferences.
Bilal obtained a PhD in nanoelectronics in 2022 from the Grenoble Alpes university (France) and he studied at IAE Grenoble for a management master degree.
The International Microelectronics and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics. Founded in 1967, IMAPS has professional members in 23 North American chapters and 21 international chapters.
