Tradeshows & Conferences
EPTC 2022 – 24th Electronics Packaging Technology Conference
The 24th IEEE Electronics Packaging Technology Conference (EPTC2022) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputed international electronics packaging conference and is the EPS flagship conference in the Asia-Pacific Region. It aims to cover the complete spectrum of electronics packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation and AI. EPTC2022 conference will feature keynotes, a panel, HIR Workshop, technical sessions, invited talks, PDCs, interactive sessions, packaging education workshop, an exhibition and networking activities.
Yole Intelligence powered by Yole Goup will be part of the program with:
Yik Yee TAN, Senior Technology and Market Analyst
December, 7th – 3:45-5:15 pm
Chiplets as enabler for system scaling
Chiplets (or dielets) are gaining traction in the industry as key enabler for future system performance scaling and functional diversification. Unlike monolithic SoC, this technology allows one to mix and match disparate dielets and assemble them using innovative interconnect schemes. It leads to flexible IP reuse, higher yield, shorter time to market and modularity with performance that matches that of SoC. This panel revisits the drivers behind chiplets technology, the manufacturing ecosystem, and use-cases. The Universal Chiplet Interconnect Express (UCIe) will also be discussed. This panel ends with a critical examination on the supply chain and market outlook.
More information and registration: HERE
Yik Yee Tan
Senior Market & Technology Analyst, Semiconductor Packaging & Assembly
Yik Yee Tan, PhD. is a Senior Technology & Market Analyst, Semiconductor Packaging & Assembly at Yole Intelligence, part of Yole Group (Yole), within the Semiconductor, Memory & Computing division.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market reports and is engaged in dedicated custom projects.
Prior to Yole, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
Yik Yee Tan holds a Ph.D. in Engineering Science from Multimedia University (MMU, Malaysia).