Tradeshows & Conferences
EPTC 2022 – 24th Electronics Packaging Technology Conference
The 24th IEEE Electronics Packaging Technology Conference (EPTC2022) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputed international electronics packaging conference and is the EPS flagship conference in the Asia-Pacific Region. It aims to cover the complete spectrum of electronics packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation and AI. EPTC2022 conference will feature keynotes, a panel, HIR Workshop, technical sessions, invited talks, PDCs, interactive sessions, packaging education workshop, an exhibition and networking activities.
Yole Intelligence powered by Yole Group will be part of the program with:
Yik Yee TAN, Senior Technology and Market Analyst
December, 7th – 3:45-5:15 pm
Ecosystem, Supply Chain and Outlook
More information and registration: HERE
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Yik Yee Tan, PhD is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).