EPTC 2024 –  ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE

In 2024, the conference will feature keynotes, technical sessions, technology talks, exhibition corners and networking activities. It aims to provide a platform to cover the technology developments in the complete spectrum of electronics packaging from design to manufacturing. Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region 10, covering diverse areas of electronic packaging technology topics. These include materials, equipment, components, modules & system assemblies, reliability, interconnect design, heterogeneous integration, advanced packaging, flexible electronics, emerging technologies, co-package optics, smart manufacturing, and AI/ML.

With more than 100 experts from diverse semiconductor packaging technology areas, the program will be engaging for the international packaging community. It will be supplemented by an exhibition, which provides an opportunity for leading companies to exhibit their latest technologies and products.