Tradeshows & Conferences
EPTC 2025
Insights that Power the Future of Test
EPTC 2025 (Electronics Packaging Technology Conference) is a leading international event focused on advanced packaging, assembly, and reliability for next-generation electronic systems. Gathering global experts, engineers, and decision-makers, the conference provides a unique platform to explore the latest breakthroughs, share technical expertise, and address the challenges driving tomorrow’s semiconductor and system-level integration.
Yole Group will be on site to connect with partners and industry professionals. Our experts will be available to discuss market and technology trends across advanced packaging, heterogeneous integration, and system-in-package architectures. We look forward to meeting you, exchanging insights, and contributing to the conversations shaping the future of electronics packaging worldwide.
Yole Group will be part of program with
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Friday, December 5th
11:00-11:30am: AI Is Accelerating the Shift to Advanced Packaging with FOPLP
Yik Yee Tan, PhD
Principal Analyst, Semiconductor Packaging
Yik Yee Tan, PhD is Principal Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).
