Aiming at facilitating mutual engagement, the European Packaging, Assembly, and Test – Workshop 2023 will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts along the complete semiconductor packaging supply chain, to collectively strengthen the semiconductor packaging eco-system in Europe.
Key topics presented
- European market and supply chain
- European OSAT industry capabilities
- Device and packaging manufacturers trends in challenging times
- Advocacy for the packaging, assembly, and test industry in Europe
- Reliability and quality of electronic devices and systems
Yole Group will be part of it with:
Gabriela Pereira
Technology & Market Analyst,
Semicondutor Computing and Memory Division
Yole Intelligence part of Yole Group
Wednesday, September 6
Status of the Advanced Packaging Business
ABSTRACT
The presentation will share the latest metrics of the Advanced Packaging market including the newest manufacturing capabilities being put in place worldwide with a focus on Europe. European governments are investing in chip manufacturing to strengthen its local supply chain; however, assembly and test capacity is needed to boost time-to-market and decrease overseas dependency. With a 9.1% growth expected for the next five years, advanced packaging has become a critical and effective strategy for improved performance, following the industry’s latest megatrends of AI, HPC and vehicle electrification.
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Gabriela Pereira
Technology & Market Analyst
Gabriela Pereira is a Technology & Market Analyst in the Packaging team within the Semiconductor, Memory and Computing Division at Yole Intelligence, Yole Group (Yole).
Gabriela is focused on advanced packaging platforms.
Prior to Yole, Gabriela worked as an R&D Engineer at Amkor Technology, where she collaborated on several package development projects.
Gabriela holds a master’s degree in Metallurgical and Materials Engineering from the University of Porto (Portugal).
