Tradeshows & Conferences
GLASS4CHIPS SUMMIT 2026
Innovating Semiconductor Packaging
GLASS4CHIPS Summit 2026 is a premier international conference focused on the role of glass and advanced substrates in semiconductor packaging and integration. The summit brings together industry leaders, materials suppliers, equipment manufacturers, and technology experts to discuss the latest innovations in advanced packaging, 3D integration, heterogeneous integration, chiplets, and substrate technologies. Participants will explore how glass-based solutions, interposers, and other substrates are driving performance, miniaturization, and reliability in next-generation semiconductor devices. Through presentations, panels, and networking, GLASS4CHIPS provides a platform for deep technical exchange and collaboration in the packaging ecosystem.
Yole Group will be present at GLASS4CHIPS Summit 2026. We will share the latest market intelligence, technology insights, and strategic perspectives on semiconductor packaging innovations, substrate technologies, and integration trends. We look forward to connecting with the community, discussing emerging opportunities, and exploring the future of semiconductor packaging enabled by advanced glass and substrate technologies.
Yole Group will be part of program with:
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Thursday, May 14th, 1:30 – 3:15pm
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Bilal Hachemi, PhD is a Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
He contributes on a day-to-day basis to the analysis of packaging technologies, their related materials and manufacturing processes.
Previously, Bilal carried out experimental research in the field of nanoelectronics and nanotechnologies, focusing on emerging dielectric materials and their ferroelectric applications. He (co-) authored several papers in high-impact scientific journals and was participated in several international conferences.
Bilal obtained a PhD in nanoelectronics in 2022 from the Grenoble Alpes university (France) and he studied at IAE Grenoble for a management master degree.
