Tradeshows & Conferences

HI-CHIP ALLIANCE 2026

Bridging the AI Era: Strategic Perspectives at the Hi-CHIP Alliance Forum

The Hi-CHIP Alliance Meeting is a premier technical and strategic platform dedicated to the rapid advancement of heterogeneous integration and chiplet system packaging. Spearheaded by Taiwan’s leading semiconductor ecosystem, this forum brings together foundry pioneers, IC designers, material suppliers, and OSAT leaders to explore breakthroughs in advanced substrates, hybrid bonding, and 3D/Fan-Out process integration. Participants will examine how collaborative, modular chiplet architectures are essential to meet the surging hardware demands of next-generation Artificial Intelligence (AI) and High-Performance Computing (HPC).

Yole Group is pleased to participate in the Hi-CHIP Alliance event. We will share our latest market intelligence and technology roadmaps, focusing on how AI-driven demand is reshaping the advanced packaging supply chain.

Yole Group will be part of program with:



Gary HUANG
Corporate VP, Head of Asia Pacific, Research and Business Development

Thursday, June 18th
09:35am – 10:05am : ADAS in the Physical AI Era: Architecture Shifts and Supply-Chain Power Moves

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