ICEPT SHANGHAI

The International Conference on Electronic Packaging Technology (ICEPT) is one of the most cohesive packaging technology conference in Asia. ICEPT 2025 will be held by Shanghai University, IEEE Electronics Packaging Society (IEEE-EPS), and Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT).
ICEPT held in China every year, conference topics including Packaging Design, Manufacturing Technologies, R&D, and Photonics, MEMS, System Integrated Packaging etc… Since it inaugurated in 1994, ICEPT has been held by several universities for 25 sessions.
Today, ICEPT attracts a large number of domestic and foreign universities, research institutions, electronic packaging manufacturers participate, more than 800 Well known experts, scholars and business people from about 20 countries and regions are expected to attend ICEPT 2025.