Tradeshows & Conferences
IEEE RSM – IEEE REGIONAL SYMPOSIUM OF MICRO AND NANOELECTRONICS
Sign in for replayexploring various issues and trends in the field of semiconductor electronics
Over the last eighteen years, the RSM conference series has become the prominent international forum on semiconductor electronics embracing all aspects of the semiconductor technology from circuit device, modelling and simulation, photonics and sensor technology, MEMS technology, process and fabrication, packaging technology and manufacturing, failure analysis and reliability, material and devices and nanoelectronics.
Yole Group is part of the program with:
Yik Yee Tan
Senior Technology and Market Analyst
Yole Intelligence
Monday, August 28
Morning: Advanced Packaging Market and Technology Trend
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Yik Yee Tan
Senior Market & Technology Analyst, Semiconductor Packaging & Assembly
Yik Yee Tan, PhD. is a Senior Technology & Market Analyst, Semiconductor Packaging & Assembly at Yole Intelligence, part of Yole Group (Yole), within the Semiconductor, Memory & Computing division.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market reports and is engaged in dedicated custom projects.
Prior to Yole, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
Yik Yee Tan holds a Ph.D. in Engineering Science from Multimedia University (MMU, Malaysia).
