Tradeshows & Conferences
IMAPS DPC 2025
21st international conference & exhibition on device packaging
Organized by the International Microelectronics Assembly and Packaging Society (IMAPS), this renowned international event serves as a major forum for the exchange of knowledge in the rapidly evolving field of device packaging. It provides an exceptional opportunity to connect with industry experts, share insights, and explore the latest advancements in microelectronics packaging.
Join Yole Group on site as we will provide deep insights into emerging trends, technologies, and market opportunities within the device packaging and microelectronics sectors. Our team will be present at DPC 2025 to discuss the latest developments, share our comprehensive analyses, and explore potential collaboration opportunities with industry leaders and professionals.
Yole Group will be part of the program with:
Gabriela Pereira
Technology & Market Analyst, Semiconductor Packaging
Wednesday, March 5th
9:15-9:45am: AI Market Today and Beyond: Transforming the Future of
Advanced Packaging
Thursday, March 6th
10:30-11am: Fan-out Panel Level Packaging: Driving Market Momentum for High-End System Integration
Gabriela Pereira
Senior Technology & Market Analyst, Semiconductor Packaging
Gabriela Pereira is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Working within the semiconductor packaging activities at Yole Group, Gabriela focuses on advanced packaging platforms, develops technology & market reports, and is engaged in dedicated custom projects.
Gabriela’s experience in the semiconductor field includes working at Amkor Technology, first for her master’s thesis and then as a R&D Engineer, where she collaborated on several package development projects.
Gabriela holds a master’s degree in metallurgical and materials engineering from the University of Porto, Portugal.
