Tradeshows & Conferences
IMAPS DPC 2026
IMAPS Device Packaging
The IMAPS Device Packaging Conference (DPC) 2026 is an international event dedicated to advanced semiconductor packaging technologies. Bringing together industry experts, technology providers, researchers, and decision-makers, the conference provides a unique platform to explore the latest developments in heterogeneous integration, advanced packaging architectures, materials, processes, and manufacturing innovations. Through technical presentations, expert panels, and industry networking sessions, IMAPS DPC fosters knowledge exchange and collaboration across the global packaging ecosystem.
Yole Group will be attending IMAPS DPC 2026 and will be present throughout the event to engage with industry leaders and partners. Our experts will share our latest market intelligence, technology insights, and strategic perspectives on advanced packaging, heterogeneous integration, and the broader semiconductor ecosystem. We look forward to contributing to discussions and connecting with the packaging community at this key industry gathering.
Yole Group will be part of program with
Gabriela Pereira
Senior Technology & Market Analyst, Semiconductor Packaging
Wednesday, March 4th
1:30pm: Advanced Packaging Market Trends in the AI Era
Gabriela Pereira
Senior Technology & Market Analyst, Semiconductor Packaging
Gabriela Pereira is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Working within the semiconductor packaging activities at Yole Group, Gabriela focuses on advanced packaging platforms, develops technology & market reports, and is engaged in dedicated custom projects.
Gabriela’s experience in the semiconductor field includes working at Amkor Technology, first for her master’s thesis and then as a R&D Engineer, where she collaborated on several package development projects.
Gabriela holds a master’s degree in metallurgical and materials engineering from the University of Porto, Portugal.
