Tradeshows & Conferences
IMAPS EXECUTIVE SUMMIT 2025
Driving the Future of Microelectronics
The IMAPS Executive Summit 2025 is a premier gathering of senior leaders, innovators, and decision-makers shaping the global microelectronics industry. This exclusive event provides a platform to discuss the latest developments in advanced packaging, semiconductor manufacturing, and system integration, while addressing the strategic challenges and opportunities driving the future of high-performance electronics. With a focus on executive-level insights and networking, the summit serves as a unique forum to exchange perspectives on technology, business, and market evolution.
Yole Group will be on site to share its vision and expertise on the dynamics transforming the semiconductor and advanced packaging ecosystem. Our team looks forward to connecting with industry executives and discussing emerging trends in this fast-evolving landscape.
Yole Group will be part of program with:
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Wednesday, September 24th
2 – 3:30pm: Panel: Market Trends – Semiconductor Packaging as a Strategic Differentiator
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Bilal Hachemi, PhD is a Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
He contributes on a day-to-day basis to the analysis of packaging technologies, their related materials and manufacturing processes.
Previously, Bilal carried out experimental research in the field of nanoelectronics and nanotechnologies, focusing on emerging dielectric materials and their ferroelectric applications. He (co-) authored several papers in high-impact scientific journals and was participated in several international conferences.
Bilal obtained a PhD in nanoelectronics in 2022 from the Grenoble Alpes university (France) and he studied at IAE Grenoble for a management master degree.
