Tradeshows & Conferences
IMAPS SYMPOSIUM 2026
Packaging the Next Wave of Silicon: Technical and Market Insights at IMAPS 2026
An unmissable pillar for the microelectronics assembly community, the IMAPS International Symposium on Microelectronics delivers a massive showcase of packaging breakthroughs. The symposium draws an international crowd of thermal engineers, materials scientists, packaging designers, and manufacturing specialists.
Yole Group is delighted to share its industry foresight at IMAPS. Our tracking of the advanced packaging and semiconductor manufacturing markets will provide attendees with a clear commercial roadmap to complement the event’s deep technical sessions.
Yole Group will be part of program with:
Gabriela PEREIRA
Senior Technology & Market Analyst, Semiconductor Packaging
Thursday, October 1st
09:30-09:55am: Scaling the Future: Panel-Level Packaging Market Trends Uncovered
Gabriela Pereira
Senior Technology & Market Analyst, Semiconductor Packaging
Gabriela Pereira is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Working within the semiconductor packaging activities at Yole Group, Gabriela focuses on advanced packaging platforms, develops technology & market reports, and is engaged in dedicated custom projects.
Gabriela’s experience in the semiconductor field includes working at Amkor Technology, first for her master’s thesis and then as a R&D Engineer, where she collaborated on several package development projects.
Gabriela holds a master’s degree in metallurgical and materials engineering from the University of Porto, Portugal.
