Tradeshows & Conferences
IMPACT 2025
Shaping Tomorrow’s Semiconductor Landscape
IMPACT 2025 (International Microsystems, Packaging, Assembly and Circuits Technology Conference) is Asia’s leading technical conference focused on advanced packaging, heterogeneous integration, and system-level innovations in microelectronics. Held annually in Taiwan, the event brings together industry leaders, researchers, and engineers to explore the latest developments in packaging technologies critical to enabling AI, HPC, automotive, and next-generation consumer electronics.
Yole Group will be attending IMPACT 2025 to engage with the global packaging community and share strategic insights into technology roadmaps and market evolution. As advanced packaging becomes a key enabler of semiconductor performance and system integration, topics such as chiplet architectures, 3D packaging, substrate innovation, and supply chain dynamics will be at the heart of the discussion. We look forward to contributing to this forward-looking exchange and supporting the continued growth of the packaging ecosystem.
Yole Group will be part of program with:
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Thursday, October 23rd
2:30 – 3pm: Advanced Packaging and IC substrates in the AI and HPC era
Location: 4F stage, TaiNEX 1
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Bilal Hachemi, PhD is a Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
He contributes on a day-to-day basis to the analysis of packaging technologies, their related materials and manufacturing processes.
Previously, Bilal carried out experimental research in the field of nanoelectronics and nanotechnologies, focusing on emerging dielectric materials and their ferroelectric applications. He (co-) authored several papers in high-impact scientific journals and was participated in several international conferences.
Bilal obtained a PhD in nanoelectronics in 2022 from the Grenoble Alpes university (France) and he studied at IAE Grenoble for a management master degree.
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Since its inception in 2006, the IMPACT Conference has been at the forefront of technological evolution, fostering innovation in the packaging, PCB, and semiconductor industries. Over the past two decades, IMPACT has not only witnessed but actively contributed to rapid advancements in 5G, AI, high-performance computing (HPC), edge computing, and sustainability. Each year, the conference has adapted to the latest trends, driving forward the conversation on emerging technologies and their industrial applications.
