Tradeshows & Conferences
SEMI JAPAN: IMPORTANCE OF AI CHIP DESIGN AND CHIPLET MARKET GROWTH STRATEGY – WEBINARSign in for replay
Packaging, the driving forces that will greatly change the way semiconductors should be in the future.
“The semiconductor packaging field has become a hot topic, and it is one of the driving forces that will greatly change the way semiconductors should be in the future. In particular, AI chips are capable of performing advanced arithmetic processing with extremely low power consumption compared to conventional CPUs. “
Yole Group will be the guest speaker with:
Technology & Market Analyst – Packaging and Assembly
Technology and Market Trends of High-End Performance Packaging as the fastest growing advanced packaging platform
Advanced Packaging has become extremely important when it comes to follow the More than Moore trend ensuring high performance integration and functionality to continuously growing in complexity dies resulting in device performance and bandwidth increase. It allows also to compensate the rising costs associated to front-end manufacturing by making possible chiplet and heterogeneous integration. High-End Packaging with 2.5D & 3D integration is expected to be the fastest growing platform reaching $16B by 2028. Foundries and IDMs are leaders for 2.5D & 3D packaging solutions but OSATs are following this trend as well. Hybrid bonding with wafer to wafer, die to wafer approach is the hot topic technology breakthrough as it allows to achieve 10μm fine pitch and less. This enables denser 3D IC stacking of logic or memory dies, the interconnection of partitioned SoC dies and heterogeneously integrated packages. What is Yole’s definition for advanced packaging and for high-end performance packaging? From technology to market, an overview of innovations, applications, players & markets will be shared and debated to shed light on these questions and on 2.5D and 3D packaging impact on industry.
Technology & Market Analyst
Stefan Chitoraga is a Technology and Market Analyst specializing in Packaging and Assembly at Yole Intelligence, part of Yole Group.
As part of the Semiconductor, Memory & Computing division at Yole, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market reports and custom consulting projects.
Prior to Yole, Stefan served as a Package Design Engineer at Teledyne E2V for 4 years, where he was in charge of the ceramic package and glass lid development for image sensors, developing mechanical design, routing, electrical and thermal simulations.
Stefan holds a Bachelor’s in Electronics and Computer Science for Industry Applications from the Polytech Grenoble (France).