Tradeshows & Conferences

ISES JAPAN 2025

Driving Innovation in Semiconductor Manufacturing and Sustainability

ISES Japan 2025 (International Semiconductor Executive Summit) gathers global leaders from the semiconductor ecosystem to discuss the latest developments shaping the industry’s future. The event serves as a key platform for executives, innovators, and technology experts to exchange ideas on advanced manufacturing, supply chain resilience, sustainability, and emerging technologies driving the next wave of semiconductor growth. Through keynote sessions, panel discussions, and networking opportunities, ISES Japan fosters collaboration and strategic partnerships across the global semiconductor community.

Yole Group is pleased to participate in ISES Japan 2025 as part of our ongoing engagement with industry leaders worldwide. Our experts will be on site to share market insights and technology analyses on key semiconductor segments, offering a comprehensive perspective on innovation trends and business opportunities. Join us at ISES Japan to connect with our analysts, attend our presentation, and explore how Yole Group supports strategic decision-making across the semiconductor value chain.

Yole Group will be part of program with:



Dimitrios Damianos, PhD
Senior Manager – Consulting

Tuesday, December 2nd
4:50 – 5:10pm: AI-driven Advanced Packaging – trends, market view and a Japanese perspective

Datacenter AI workloads are rewriting packaging rules. Bandwidth per millimeter, thermal density, and module yield now define system performance.
This presentation examines genAI’s impact on the semiconductor industry with a focus on advanced packaging, from 2.5D (HBM) to emerging 3D (logic–memory stacking), hybrid bonding, glass-core, etc.
 
Participants will learn about the latest market forecasts for devices/packages driving the growth in this category, as well as application/technology trends. Beyond global industry players, we will highlight Japan’s strengths in chemicals, packaging materials, substrates and equipment that anchor CoWoS-class platforms and next-generation 3D assemblies.

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