Tradeshows & Conferences
MSIA E&E FORUM 2024
Semiconductor As A Catalyst For The Malaysia Economy
The National E&E Forum 2024 will provide a comprehensive exploration of the semiconductor industry’s pivotal role in driving the Malaysian economy. Featuring keynote sessions and three insightful panels, the forum will bring together thought leaders and experts to address critical advancements and challenges shaping the industry.
Key topics include strategies for advancing IC design with speakers from leading tech and semiconductor companies who will share real-world experiences and lessons on moving up the value chain. A panel on the transformative impact of AI, featuring leaders AI, cloud-computing, software and hardware companies will delve into how AI is revolutionizing various sectors, reshaping industries, and raising questions about responsible innovation. Finally, experts will discuss the future of semiconductor manufacturing through advanced packaging technologies, revealing how these innovations support the continued scaling of Moore’s Law and redefine manufacturing capabilities.
This forum offers attendees a deep dive into the technologies and strategies essential to the semiconductor sector’s role as a catalyst for Malaysia economic transformation.
Yole Group will be part of the program with:

Yik Yee Tan
Senior Technology and Market Analyst,
Semiconductor Packaging
November 25, 2024
09:30 am – How Generative AI impact on Advanced Packaging.
Yik Yee Tan, PhD
Principal Analyst, Semiconductor Packaging
Yik Yee Tan, PhD is Principal Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).