Tradeshows & Conferences
NAVIGATING SEMICONDUCTOR PACKAGING COMPLEXITIES – WEBINAR POWERED BY HENKEL
Driven by generative AI and HPC, cutting-edge package architectures present new advanced packaging challenges requiring material solutions.
According to Yole Group, Artificial intelligence (AI) and high-performance computing (HPC) are driving the need for higher-density, higher-performance package solutions. Because of this, advanced packaging revenues are set to grow at over 10% year-over-year through 2029, with high-density fan-out (HD-FO)/2.5D and 3D IC packages expected to realize 23% CAGR over the next five years.
Join Yole Group for an insightful online event hosted by our partner, Henkel, as we delve into the dynamic realm of advanced packaging market evolution and innovative material solutions. In this exclusive webinar, industry experts will convene to explore the rapid evolution of the advanced packaging market. Speakers, including Yik Yee Tan, Solomon Wu and QiongRuo Ruan, will delve into key insights, shedding light on the latest trends, market projections, and technological advancements shaping the landscape.
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Yole Group will be part of the program with:
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Wednesday, August 21, 2024
2 p.m. (China Time): Advanced packaging market forecast
Yik Yee Tan, PhD
Principal Analyst, Semiconductor Packaging
Yik Yee Tan, PhD is Principal Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).
Henkel Building on a strong legacy of more than 145 years, we are leading the way to reimagine and improve life every day. Today and for generations to come. Through our innovative and sustainable brands and technologies, across our teams around the world. Henkel holds leading positions in both industrial and consumer businesses: Our portfolio includes well-known hair care products, laundry detergents, fabric softeners as well as adhesives, sealants, and functional coatings.
