Tradeshows & Conferences

NEPCON JAPAN 2026

Insights that Power the Future of Test

NEPCON Japan 2026 is one of the leading international exhibitions dedicated to electronics design, manufacturing, and packaging. Bringing together engineers, innovators, and industry leaders, the event offers a key platform to discover new technologies, explore manufacturing advances, and discuss the challenges shaping next-generation electronic systems.

Yole Group will be on site to meet partners and industry professionals. Our experts will be available to discuss market and technology trends across semiconductor manufacturing, advanced packaging, assembly, and inspection.
We look forward to connecting with you in Tokyo, sharing insights, and contributing to the conversations driving progress across the electronics industry.

Yole Group will be part of program with

Milan Rosina, PhD
Principal Analyst, Power Electronics and Batteries

Friday, January 23rd
12:30-2:40pm: Advanced Packaging Solutions for Si, SiC, and GaN Power Devices in Hybrid and Electric Vehicles

Yik Yee Tan, PhD
Principal Analyst, Semiconductor Packaging

Friday, January 23rd
12:30-2:40pm: Advanced Packaging for Datacenter and ADAS

You can also read our related article, recently published, for more insights:

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