OPTICAL INTERCONNECTS AND PACKAGING CONFERENCE (OIP) 2026

The OPTICAL INTERCONNECTS AND PACKAGING CONFERENCE (OIP) is a premier global event dedicated to the collaborative development of next-generation semiconductor designs. Bringing together EDA partners, IP providers, and IC designers, the forum explores technical innovations in advanced process nodes (2nm and beyond), 3D Fabric™ packaging technologies, and silicon photonics. Participants will examine how specialized design flows and multi-die integration are enabling the high-performance computing (HPC), AI, and mobile innovations that define the modern semiconductor landscape.

Yole Group is pleased to participate in the OIP Ecosystem Forum. We will share our latest market intelligence and technology roadmaps, focusing on the critical intersection of advanced semiconductor manufacturing and next-generation packaging. We look forward to connecting with the ecosystem to discuss the strategic shifts in the supply chain—from the rise of chiplets to the evolution of substrate materials—that are driving the future of the global semiconductor industry.