Tradeshows & Conferences

PCIM 2026

Accelerating Power Electronics for a Sustainable Future

PCIM Europe 2026 is the leading global event for the power electronics industry, bringing together researchers, technology providers, and industry leaders to explore the latest innovations shaping the future of electrification, energy efficiency, and sustainable mobility. This world-class conference and exhibition provide a unique platform to dive into key topics such as SiC and GaN semiconductors, power modules, advanced packaging, and system-level integration across automotive, industrial, and renewable energy applications.

Join Yole Group on site as our team presents cutting-edge insights into the evolution of power electronics markets, from semiconductor technologies and packaging innovations to emerging application trends. We look forward to engaging with industry professionals, sharing our latest analyses, and discussing how our expertise can support strategic decision-making and innovation across the power electronics ecosystem. Don’t miss the opportunity to connect with us and learn more!



Yole Group will be on-site at booth #501 in hall 7 to provide valuable insights into key industry trends, breakthrough technologies, and market forces driving the next wave of power electronics innovation.

Whether you aim to explore new growth opportunities, strengthen your competitive positioning, or identify potential collaborations, our experts will be available to discuss how Yole Group’s research and consulting services can empower your business in navigating the rapidly evolving power electronics landscape.

Yole Group will be part of the program with:

Location: Hall 4

Pietro Scalia
Head of Power System Architecture and Marketing

Hassan CHEITO

Hassan Cheaito, PhD
Senior Technology & Market Analyst, Power Electronics & Battery

Maawad Makdessi
Field Application Engineer for West Europe & FAE Coordinator for EMEA

Tuesday, June 9th,
11:20am – 12:20pm: Data Center Power Delivery: From 800 V Architectures to Advanced IBC & POL Solutions

The surge of AI workloads is driving a radical transformation of data center power delivery, from grid to core. Rising rack power, the transition toward 800 V distribution, and extreme low-voltage, high-current demands are reshaping IBC and POL architectures. This presentation combines system, active, and passive perspectives to provide a comprehensive view of this evolution. Yole Group will outline key market and technology trends, including the emergence of HV IBC and the shift toward higher density and efficiency. Renesas will illustrate architectural innovations and scalable building blocks enabling next-generation AI infrastructure. YAGEO will address how advanced passive components overcome new constraints in high-frequency, high-power designs. Together, these insights highlight the convergence of system design and component innovation in future data centers.

Location: Hall 6



Milan Rosina, PhD
Principal Analyst, Power Electronics and Battery

Tuesday, June 9th
12:55 – 1:15pm: SiC Adoption, High-Voltage Platforms and Supply Chain Evolution in xEV Power Electronics

The electrified vehicle market has entered a new phase shaped by rapid technology innovations, cost pressures, and evolving supply chains. Power electronics is at the center of this transformation, driven by the growing adoption of silicon carbide devices, the transition toward 800 V and higher voltage platforms, and increasing integration of powertrain components. At the same time, the industry faces strategic uncertainties: the long-term coexistence of SiC and silicon IGBTs, the future role of GaN technologies, cost reduction challenges for mass-market electric vehicles, and the evolving balance between global suppliers and vertically integrated OEMs.

This presentation highlights key questions currently shaping the xEV power electronics landscape, covering technology choices, system architectures, and supply chain dynamics. By examining these open questions, the talk aims to stimulate discussion within the power electronics community and provide insights into the trends likely to define the next decade of electrified mobility.

Location: Hall 5



Roy Dagher, PhD
Technology & Market Analyst, Compound Semiconductors

Wednesday, June 10th
2:10 – 2:30pm: GaN Powering the AI Datacenter: Enabling Efficient Next-Generation Power Delivery

The rapid expansion of AI and cloud computing is transforming datacenter power architecture. As power demand per rack exceeds 100 kW and efficiency becomes critical, GaN is emerging as a key enabler of next-generation power delivery. Compared with silicon devices, GaN offers higher switching frequency, lower losses, and greater power density, enabling more compact and efficient DC-DC conversion stages. These benefits are particularly valuable for hyperscale datacenters where energy consumption, cooling, and footprint directly impact operating costs and sustainability goals. GaN is set to penetrate Power Supply Unit (PSU) as well as HV and LV intermediate bus converters (IBC), enabling the datacom sector to capture about 25% of the $3B power GaN market by 2031. This presentation will highlight the market drivers and technological benefits behind GaN adoption, while exploring how it is reshaping datacenter power design to unlock new efficiency gains.

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