Tradeshows & Conferences
SEMI 3D & SYSTEMS SUMMIT 2025
Powering 3D Innovation
The SEMI 3D & Systems Summit 2025 stands as a key gathering for experts in the field of advanced packaging and 3D integration. This international event highlights the latest innovations in chiplet technologies, heterogeneous integration, system-in-package (SiP), and high-density interconnects. It offers a unique opportunity to explore how these technologies are shaping the future of computing, AI, and high-performance systems.
Yole Group will take part in this year’s summit. Our team will be present to share fresh insights into market trends and technological developments impacting advanced packaging. We look forward to engaging with industry leaders, exchanging ideas, and contributing to the conversations driving the semiconductor ecosystem forward.
Yole Group will be part of program with:
Vishal Saroha
Technology & Market Analyst, Semiconductor Equipment
Friday, June 27th
9:20am: Status of High-End Performance Packaging (2.5D & 3D) and Co-packaged Optics – Market and Technology Trends
Vishal Saroha
Technology & Market Analyst, Semiconductor Equipment
Vishal Saroha is Technology & Market Analyst, Semiconductor Equipment at Yole Group.
Based in Dresden (Germany), he focuses on developing technology and market products and custom consulting projects in the manufacturing and global supply chain domain.
Prior to Yole Group, Vishal worked at GlobalFoundries, Dresden, first as an Integration & Yield Engineer and then as Sr. Engineer - Integration Engineering, where he was the owner of device and SRAM targeting-related activities on their 22FDX technology. Previously, he also had experience at imec (Belgium), where he worked on issues related to 3DIC packaging and device reliability.
Vishal holds a master's in nanotechnology from Katholieke Universiteit Leuven (Belgium) and a bachelor's in physics from the University of Delhi (India).
