Tradeshows & Conferences
SEMICON KOREA 2026
Driving Innovation Across the Global Semiconductor Ecosystem
SEMICON Korea 2026 is one of the leading semiconductor events in Asia. The event showcases the latest innovations in semiconductor manufacturing, equipment, materials, and advanced technologies, while addressing strategic challenges and market trends shaping the future of the industry. Through exhibitions, conferences, and technical sessions, SEMICON Korea serves as a key platform for collaboration and knowledge exchange.
Yole Group will be attending SEMICON Korea 2026 and will be on site throughout the event. Our analysts and consultants will be available to discuss market trends, technology roadmaps, and strategic insights across the semiconductor ecosystem. We look forward to connecting with industry leaders, partners, and innovators during this major international event.
Yole Group will be part of the program with:
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Thursday, February 12th
3:10 – 3:35pm: Advanced Packaging Market & Technology Trends – Focus on Glass
Remote presentation
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In the second half of the 2020s decade, Advanced Packaging progressed to take the responsibility of AI hardware’ biggest challenges to enable it to deliver more computing power at a mastered cost by enlarging the package size, pushing the interconnect frontiers and the design philosophy. Glass will be a key pillar for advanced packaging in the second half of the current decade by targeting several entry points to the advanced packaging landscape at the IC substrate, Interposer, carrier and more emerging glass-based technology for Advanced Packaging. In addition to Glass, penalization, hybrid bonding, 3D stacking are the other pillars allowing Advanced Packaging to support the AI explosion and its evolution to next generations. The supply chain has changed accordingly with more geographical impact on investments, collaborations, and business models.
Bilal Hachemi, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Bilal Hachemi, PhD is a Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
He contributes on a day-to-day basis to the analysis of packaging technologies, their related materials and manufacturing processes.
Previously, Bilal carried out experimental research in the field of nanoelectronics and nanotechnologies, focusing on emerging dielectric materials and their ferroelectric applications. He (co-) authored several papers in high-impact scientific journals and was participated in several international conferences.
Bilal obtained a PhD in nanoelectronics in 2022 from the Grenoble Alpes university (France) and he studied at IAE Grenoble for a management master degree.
