Tradeshows & Conferences

SEMICON SOUTHEAST ASIA 2026

Connecting with the Semiconductor Ecosystem

SEMICON Southeast Asia 2026 is one of the key gatherings for the semiconductor and electronics manufacturing ecosystem in the Asia-Pacific region. The event brings together industry leaders, equipment manufacturers, materials suppliers, technology innovators, and policymakers to discuss the trends shaping semiconductor packaging, assembly, and related supply chains. Key topics include advanced packaging technologies, heterogeneous integration, 3D ICs, chiplets, substrate and interposer innovations, and the growing role of Southeast Asia in the global packaging ecosystem.

Yole Group will be present during the event to connect with partners, clients, and industry stakeholders. Our team will share the latest market intelligence, technology insights, and strategic analysis focused on semiconductor packaging trends, emerging architectures, and innovations in assembly and integration processes. We look forward to engaging with the community and exploring the opportunities shaping the future of semiconductor packaging in Southeast Asia and beyond.

Yole Group will be part of program with:

Yik Yee Tan, PhD
Principal Analyst, Semiconductor Packaging

Monday, May 4th, time coming soon…
The Intensifying Race in Panel-Level Packaging

ABSTRACT

Driven by rapid growth in AI, automotive, and high-performance applications, advanced packaging has become a key enabler of system-level integration as traditional scaling reaches its limits. Among emerging solutions, panel-level packaging (PLP) is gaining renewed attention for its potential to deliver cost efficiency, higher throughput, and larger form factors compared to wafer-based approaches.

Initially adopted for cost down and high-volume manufacturing such as PMICs, RF IC and QFN package replacement, PLP is now being reconsidered for more advanced applications, including AI-driven systems requiring larger and more complex packages. This evolution is accelerating competition across the ecosystem, with OSATs, IDMs, and equipment suppliers actively investing to address key challenges such as warpage, yield control, and process uniformity.

This presentation provides an overview of PLP’s transition from low- to high-end applications, along with market perspectives and supply chain readiness. It highlights the level of supply chain maturity and identifies the critical technological challenges that must be addressed for broader adoption. Ultimately, highlights how these dynamics are intensifying the race in panel-level packaging and redefining competitive positioning across the semiconductor value chain.