SEMICON TAIWAN 2025

Compound semiconductors have evolved into a multi-billion-dollar market, with broad adoption across automotive, telecom and datacom, industrial, and consumer sectors.

Today, the rapid rise of high-performance computing and generative AI is driving next-generation systems to demand faster switching speeds, smaller form factors, and higher energy efficiency.

In this presentation, Yole will highlight the latest market trends across various system applications — focusing on power electronics and photonics — and discuss how the supply chain is poised to evolve in response to the growing demands of the AI era.

The semiconductor industry stands at the epitome of modern civilization, characterized by unprecedented growth and intense competition. This evolution, driven by nearly 50 years of globalization, is marked by US dominance and intricate global interdependence. The current cycle is expected to sustain at least until 2030, propelled by the revolutions in artificial intelligence and electrification, with datacenter applications poised to surpass the 10 TFLOPS/W threshold by 2028.

Central to this evolution are the node race and advanced packaging technologies, reflecting a significant shift from System-on-Chip (SoC) to chiplet architectures. Memory technologies are under considerable pressure to innovate, while market dynamics increasingly favor fabless and open foundry business models. These trends present vast opportunities across multiple sectors, elevating disruptive technologies such as neuromorphic, photonic, and quantum computing.

Governed by multiple megatrends in energy, mobility, and digital expansion, our world has truly entered the age of silicon.

The semiconductor industry continues to experience robust growth, driven by increasing demand across AI, automotive, and consumer market. As traditional scaling approaches face limitations, advanced packaging technologies have emerged as critical enablers of performance, integration, and miniaturization. This presentation provides a comprehensive overview of the semiconductor and advanced packaging market forecasts, highlighting two key trends PLP technology and glass material that shaping the industry.

Panel-Level Packaging (PLP) is gaining traction due to its potential for cost efficiency and high-volume manufacturing. However, PLP adoption introduces material challenges, including warpage control, thermal stability, and compatibility with existing processes. Simultaneously, glass substrates are being explored for their superior dimensional stability and electrical insulation properties. Despite their promise, glass materials pose challenges in handling, via formation, and integration with current packaging ecosystems. This presentation discusses both technology trends, drivers and supply chain dynamics. Offering insights into the opportunities and challenges that lie ahead for advanced packaging solutions.