Tradeshows & Conferences
SME-MNC CONNECT DAY 2026
Where innovation meets global industry
SME-MNC Connect Day 2026 is a key platform designed to foster collaboration between small and medium-sized enterprises (SMEs) and multinational corporations (MNCs). The event brings together industry leaders, innovators, and decision-makers to explore partnership opportunities, share insights on market trends, and address the challenges of scaling innovation globally. Through networking sessions, presentations, and business discussions, it enables participants to build strategic connections and drive future growth.
Yole Group will be on site throughout the event, engaging with key stakeholders across industries. Our team will share insights on market dynamics, technology trends, and strategic opportunities, while connecting with partners and companies looking to bridge innovation with large-scale industrial applications. We look forward to meaningful discussions and new collaborations emerging from this dynamic ecosystem.
Yole Group will be part of program with
Yik Yee Tan, PhD
Principal Analyst, Semiconductor Packaging
Tuesday, April 28th
4:15pm: Advanced Packaging Market Analysis & Trends
Yik Yee Tan, PhD
Principal Analyst, Semiconductor Packaging
Yik Yee Tan, PhD is Principal Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).
