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LOCATION:BERLIN\, GERMANY
DESCRIPTION:RESHAPE the Future of Electronics together: making it Additive\, Sustainable\, Flexible\, Hybrid\,  Wearable\, Structural\, and 3D.



This cutting-edge event will attract the global community from innovators and material suppliers  to equipment makers\, manufacturers and end users - who will all gather here to reshape the future of electronics.This is where the latest updates are unveiled\, where all the key conversations take place and where new ideas and projects are forged.



Yole Group will be part of it with: 











Gabriela Pereira\, Technology &amp\; Market Analyst\, Semiconductor PackagingWednesday\, October 23Opening keynote: Advanced Packaging at a Glance: Market Trends\, Technology\, and Challenges





ABSTRACT:The advanced packaging market is rapidly gaining a larger share of the semiconductor packaging industry\, with an expected growth rate of 12.9% CAGR over the next five years. This growth is primarily driven by the rise of generative AI and HPC megatrends. As system requirements for high performance increase\, the semiconductor industry is exploring innovative manufacturing approaches\, such as additive manufacturing\, to enhance packaging density\, thermal management\, and cost-effectiveness. This presentation will provide an overview of the advanced packaging market and technology trends\, highlighting new additive manufacturing techniques in the advanced packaging sector. Additionally\, it will explore Europe's efforts to bolster its R&amp\;D capabilities and expand its manufacturing capacity.
DTSTART:20241023T032206Z
DTEND:20241024T032206Z
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URL;VALUE=URI:https://www.yolegroup.com/event/trade-shows-conferences/the-future-of-electronics-reshaped-by-techblick/
DTSTAMP:20261015T012206Z
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