BEGIN:VCALENDAR VERSION:2.0 PRODID:-//hacksw/handcal//NONSGML v1.0//EN CALSCALE:GREGORIAN BEGIN:VEVENT LOCATION:Undefined. DESCRIPTION:Powering co-packaged optics with advanced semiconductor equipment and process innovation. April 28 - 8 am SGT (Singapore\, 04/28) - 5 pm PST (San Francisco\, 04/27) The webinar has now ended. For more information or to request access to the presentation slides\, please contact: For Yole Group slides: sandrine.leroy@yolegroup.com For Lam Research slides: webinar@lamresearch.com Join Lam Research and Yole Group to explore how next-generation semiconductor processing and packaging technologies are accelerating the convergence of optics and electronics in tomorrow’s data centers. This webinar\, featuring experts from Lam Research and the Yole Group\, is a must-attend for semiconductor professionals seeking to deepen their understanding of photonic technologies\, market drivers\, and manufacturing solutions. This COP live webinar is the third event featuring Lam Research and Yole Group. KEY HIGHLIGHTS Why AI infrastructure requires a breakthrough in bandwidth and energy efficiency How Co-Packaged Optics enables optical-electrical convergence The role of silicon photonics in next-generation data centers Advanced packaging innovations: hybrid bonding\, heterogeneous integration\, high-density interconnects Key architectural choices: PIC-on-EIC vs EIC-on-PIC Scaling photonics packaging for high-volume manufacturing Market outlook and ecosystem dynamics Semiconductor equipment innovations enabling manufacturable CPO architectures WEBINAR PROGRAM Moderation: Gary HUANG\, Corporate VP\, Head of Asia Pacific\, Research and Business Development at Yole Group Co-packaged optics: market landscape and technology inflection pointRaphaël MERMET-LYAUDOZ\, PhD\, Technology &\; Market Analyst in Photonics and Display at Yole Group Driving the Future of Silicon Photonics with Advanced Fabrication SolutionsDavid HAYNES\, Vice President\, Specialty Technologies\, Lam Research From Electrons to Photons: Enabling CPO Through Advanced Packaging Equipment InnovationsLee CHEE PING\, Managing Director\, Strategic Marketing\, Lam Research Live Q&\;A session with the speakersModerated by Gary HUANG\, Yole Group. Don’t miss this opportunity to gain insights from leading experts driving innovation in advanced semiconductor processing and packaging technologies for next-generation AI and photonics systems. DTSTART:20260428T172115Z DTEND:20260428T172115Z SUMMARY: URL;VALUE=URI:https://www.yolegroup.com/event/webcasts/live-webinar-co-packaged-optics-powering-the-next-wave-of-ai-infrastructure/ DTSTAMP:20260814T152115Z UID:6a7f326beae90 END:VEVENT END:VCALENDAR