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Numerous platforms and a big buzz… Is there a Fan-Out bubble?
Lost in the Fan Out packaging maze? Get some guidance from Yole Group for the most dynamic Advanced Packaging market.
Moore’s law reaching its limits opened the door for innovation beyond IC scaling. Advanced Packaging is becoming increasingly important introducing technologies with capability to change the value chain! Among them, Fan-Out Packaging is currently experiencing the most dynamic hype… Everybody is considering going Fan-Out! But why is that solution such a hot topic and is the attention deserved? Numerous Fan-Out platforms are available and under development. Do they address the same markets? Is there room for everyone?
Based on the most recent reports from Yole Développement, latest teardowns from System Plus Consulting and patent landscape analyses from KnowMade, the Yole Group, a joint collaboration of companies, proposes an in-depth review of the strategy, business, and technology trends that impact the Fan-Out industry, with a focus on the different Fan-Out platforms and their markets.
Jérôme Azémar, Market & Technology Analyst – Advanced Packaging & Manufacturing, Yole Développement
Jérôme Azémar is a member of the Advanced Packaging & Manufacturing team of Yole Développement, the “More than Moore” market research and strategy consulting company. Upon graduating from INSA Toulouse with a master’s in Microelectronics and Applied Physics, he joined ASML and worked in Veldhoven for three years as an Application Support Engineer, specializing in immersion scanners. During this time he acquired Photolithography skills which he then honed over a two-year stint as a Process Engineer at STMicroelectronics. While with STMicroelectronics, he developed new processes, co-authored an international publication and worked on metrology structures embedded on reticules before joining Yole Développement in 2013.
Nicolas Baron, CEO and co-founder, Knowmade
Dr. Nicolas Baron is CEO and co-founder of Knowmade. He is leading the Microelectonics and Nanotechnology scientific and patent analysis department. He holds a PhD in Physics from the University of Nice Sophia-Antipolis, plus a University Diploma in Intellectual Property Strategy and Innovation from the European Institute for Enterprise and Intellectual Property (IEEPI Strasbourg), France.
Romain Fraux MEMS Devices, IC’s and Advanced Packaging Project Manager, System Plus Consulting
Romain Fraux is Project Manager for Reverse Costing analyses at System Plus Consulting. Since 2006, Romain is in charge of costing analyses of MEMS devices, Integrated Circuit and Advanced Packaging. He has significant experience in the modeling of the manufacturing costs of electronics components. Romain has a BEng from Heriot-Watt University of Edinburgh, Scotland and a master’s degree in Microelectronics from the University of Nantes, France.
Camille Veyrier, Marketing & Communication Project Manager, Yole Développement
Since 2009, Camille Veyrier has been one of Yole Développement’s Marketing and Communication Project Managers, in charge of events organization and media product development (websites, e-newsletters, etc.). Camille works closely with Yole Développement’s Corporate Communication department, specifically in the fields of Power Electronics, Advanced Packaging, Compound Semiconductors, LED and Displays. Camille earned a degree in Communication & Marketing from a leading Translation and International Business school in Lyon.
Discover the related report about Fan-Out here
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Contact: Camille Veyrier (firstname.lastname@example.org)
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