Photonics, Power and RF Packaging 2022 – powered by Yole Group and CITCRegister now
New market demands create a strong connection between Power and RF packaging, and Photonics
Power electronics plays a major role in todays fast-paced world. Its key driving factors include electrical power-conversion optimization and expansion, driven by electrification trends in transportation, CO2 emission reduction goals, the development of clean electricity sources, and industrialization.
Choosing the right packaging solution is obviously key for power-related applications where reliability and safety play a major role.
Due to stronger requirements, a higher added-value for customers, and a greater desire for competitive differentiation, most innovative packaging solutions focus on power modules and integrated devices like system-on-chip (SoC) and system-in-package (SiP). Whereas in the past packaging needs were driven by industrial applications, today they are increasingly driven by electric and hybrid electric vehicles (EV/HEV). Hence, power module packaging solutions are moving towards high-performance materials and a reduction in the number of layers, size, and interfaces all while conserving electrical, thermal, and mechanical characteristics.