BEGIN:VCALENDAR VERSION:2.0 PRODID:-//hacksw/handcal//NONSGML v1.0//EN CALSCALE:GREGORIAN BEGIN:VEVENT LOCATION:Online DESCRIPTION:Semiconductor industry: it is imperative to innovate. Advanced packaging is the path forward… May 18-20\, 2021 | Online Leading players must act fast and play on their strengths to innovate and compete. And advanced packaging could most certainly be a pivotal approach. Advanced packaging has become essential for semiconductor innovation. Advanced packaging platforms allow this industry to explore new eras and innovate. And today\, advanced packaging technologies are the key to bridge the gap between die and PCB.In this dynamic context and encouraged by 7 consecutive years of successful symposiums that have attracted more than 200 participants on average\, Yole and its partner NCAP (National Center for Advanced Packaging) are proud to announce this year again\, the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors - SYNAPS. Early Bird Price : 120€ until Wednesday\, May 5 Standard Price : 150€ As a digital event\, SYNAPS offers a unique place in the world where leading companies can share their vision of the advanced packaging industry\, evaluate the emerging platforms\, and identify business opportunities. SYNAPS\, an unprecedented program.SYNAPS’s aim is to deliver a comprehensive understanding of the status of the advanced packaging industry and help companies to be part of the ‘tomorrow’ industry. SYNAPS is unique. Don’t miss it! TECHNICAL COMMITTEE The Symposium Technical Committee is a member group that takes the leadership role in setting and driving the conference’s content\, working together with the Organizing Committee. Our Committee is responsible for ensuring a well-balanced\, high quality conference program and is composed of a diverse set of senior industry experts: Amy Leong Chief Marketing Officer and Senior Vice President of  \;Mergers and Acquisitions\, FormFactor Farhang YazdaniPresident and CEO\, BroadPak Corporation Ram TrichurGlobal Head of semiconductor packaging market segment\, Henkel Santosh KumarPrincipal Analyst &\; Director Packaging\, Assembly &\; Substrates\, Yole Korea Dr. Peng SunVP\, National Center for Advanced Packaging\, NCAP China Yifan GuoVP of Engineering\, ASE Group SPONSORSHIP OPPORTUNITIES Sponsoring SYNAPS is a prime opportunity to put your company in front of more than 180 of the key industry players and decision makers of the industry. Different levels of opportunities to suit your needs – \;Discover our offers now For more information\, please contact Maelle Montmessin (maelle.montmessin@yole.fr) TIME ACCORDING TO TIMEZONE JST - Japan Standard Time : 16pm SGT - Singapore Standard Time : 15pmCST - China Standard Time : 15pm CET - Central European \;Time : 9amEST - Eastern Standard Time : 3am PST - Western Standard Time : 0am PREVIOUS EDITION Discover more information about the symposium through the 2020 edition by clicking \;here. FOCUS New technologies Wafer-Level Packaging: Fan-In\, Fan-Out Hybrid bonding Heterogeneous Integration 3D and 2.5D Stack Flip-Chip Embedded Dies IC Substrate System-in-Package Panel-Level packaging Antennas in Packages (AiP) EMI Shielding Advanced Materials for PackagingMerging Materials for Packaging Substrates Wireless packaging Packaging mobile Packaging automobile Photonics Packaging DTSTART:20210518T090000Z DTEND:20210520T113000Z SUMMARY: URL;VALUE=URI:https://www.yolegroup.com/event/yole-events/synaps-2021-symposium-by-yole-developpement-and-ncap-on-advanced-packaging-for-semiconductors/ DTSTAMP:20260815T095740Z UID:6a8038143d9fd END:VEVENT END:VCALENDAR