3D ASIP Conference: Agenda Finalized
The 2015 3D ASIP conference is just around the corner – December 15-17, at the Sofitel, Redwood City, California. 3D ASIP continues to be an excellent conference for professionals in this field. Check out the full agenda and take advantage of early registration rates ending on November 24.
Plenary presentations will be delivered by Brandon Prior, Prismark, discussing the status of 2.5/3D and other high density technologies; Rozalia Beica, Yole Développement, comparing and contrasting the new 3D memory architectures; and Dyi-Chung Hu, Unimicron, reviewing the transformation of substrate technology in the era of IoT.
Conference General Chair Phil Garrou said, “This meeting has a lot of the key, high-density interconnect players involved. This year we have included sessions comparing the silicon 2.5D interposers to alternative technologies,” (see sessions 6 and 7 in the agenda).
The program also includes sessions on 3D stacked memory products; non-TSV high density solutions; the commercialization of Fiji graphics modules with HBM memory stacks; DARPA’s DAHI heterogeneous integration 3D platform; and stacked image sensor technology.
Tuesday Tutorials
Temporary Bonding / Debonding, moderated by Matt Lueck, RTI International. Presenters include:
• Frank Fournel, CEA-Leti
• Molly Hladik, Brewer Science
• Melvin Zussman, HD MicroSystems
• David Fleming, Dow Chemical
• Shoji Otaka, TOK
• Stefan Lutter, SUSS
Design of ICs Using Interposers or Wafer-level Packaging, moderated by Herb Reiter, eda2asic, consultant. Presenters include:
• Bill Isaacson, eSilicon
• Bill Martin, E-System Design
• Norman Chang, ANSYS
• Brandon Wang, Cadence Design Systems
• Bill Acito, Product Engineer, Cadence Design Systems
• Humair Mandavia, Zuken
• John Ferguson and John Park, Mentor Graphics
Check out our growing list of sponsors and exhibitors. Opportunities are still available, but exhibit space is limited.
Don’t be left out! Secure your spot today.
Source: 3dasip.org