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$80M for Frore Systems raises $196Mm for AirJet MEMS cooling

Frore Systems has raised $80m to expand its operations and product line to tap into the growing demand for cooling AI chips.

The Series C fundraising of $80m brings the total raised by Frore Systems to $196m for its AirJet Solid-State Active Cooling. The company has also launched three plug and play, active heat removal modules designed to meet the rapidly growing demand for Edge AI.

The AirJet PAK integrates multiple solid state chips in a fully integrated, self-contained, plug and play active cooling system that is 6mm thick and is available in different form factors for various Nvidia Jetson Orin system-on-modules. SmartCow plans to be an early adopter of AirJet PAK.

The AirJet PAK 5C-25 removes up to 25 watts of heat and supports up to 100 TOPS with five chips in a footprint of 164 x 63mm. The 3C-15 has three chips and measures 106x63x6mm, removing up to 15 watts of heat and supports up to 70 TOPS. The 2C-10 has the same form factor with two chips to remove up to 10 watts of heat and supports up to 50 TOPS.

“We are currently integrating AirJet PAK into a new product line called ‘Uranus+ with AirJet’ – a cutting edge, faster, smaller, lighter, silent and dustproof AI edge embedded system.” said Ravi Kiran, CEO of SmartCow. “We are excited to combine AirJet’s innovative technology with our advanced systems to deliver a truly differentiated product that better enables Smart Cities, Smart Retail, and AI Gateway Entrances.”

The Series C fundraising is led by Fidelity Management & Research Company. Prosperity7 also made a significant investment in the round, together with all existing investors, Mayfield Fund, Clear Ventures, Addition, Qualcomm Ventures, MVP Ventures, Stepstone Group, Alumni Ventures and others.

“Heat is by far the biggest hurdle we need to overcome in computing, and to meet the massive performance increase needed for intense AI workloads,” said Patrick Moorhead, Industry expert and CEO and Chief Analyst at Moor Insights & Strategy.

“Thermally stressed hardware doesn’t perform optimally, and current thermal solutions fall short. Frore Systems has reinvented thermal technology with its AirJet chip that doubles active heat removal with a thinner, lighter, silent, dustproof, and vibration free solution that provides greater performance.”

Frore Systems will be demonstrating their latest AI cooling solutions at Computex in Taipei next month cooling up to 100 TOPS of AI workload running on Nvidia Jetson Orin platforms in thin, silent, dust proof and vibration free form factors.

“Cooling is critical to enable the performance needed to realize the full promise of AI – today and in the future. Traditional bulky and noisy thermal solutions, like fans, simply don’t meet the challenge.” said Dr Seshu Madhavapeddy, founder and CEO of Frore Systems. “We are thrilled to have the support of our investors to scale our AirJet solutions which make devices faster, thinner, lighter, silent, dustproof and vibration free. AirJet is the ideal thermal solution for products adopting the latest AI capabilities.”

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